Expertise collaboration Delivers a ready-to-manufacture Digital Linked Cluster (DCC) platform for the 2-wheeler and 3-wheeler market.
— Kiran Kumar Nagendra, AVP- Embedded Programs, Tessolve
SAN JOSE, CALIFORNIA, USA, April 9, 2024 /EINPresswire.com/ — Tessolve has collaborated with NXP® Semiconductors to advance the productization of a mass-market digital related cluster reference design primarily based on NXP’s i.MX RT1170 crossover MCU, AW611 Wi-Fi/Bluetooth combo chip, KW45 Bluetooth LE sensible entry MCU, and PF5103 multi-channel PMIC. This collaboration goals to ship an industry-leading resolution to OEMs, providing sophistication and ease of integration into autos with minimal customization necessities. By providing this product resolution, Tessolve considerably streamlines the analysis, improvement, and deployment processes for OEMs looking for to combine cutting-edge digital cluster options into their autos. This synergy finally reduces complexity, prices, and time-to-market for OEMs.
Tessolve’s Digital Linked Cluster, powered by the NXP i.MX RT1170-based SMARC SoM is tailor-made for the 2-wheeler and 3-wheeler market and boasts automotive compliance. That includes a 5” show (upgradeable to 7”), NXP chipsets for BLE and Wi-Fi 6 connectivity, multi-channel energy administration, and CAN interface, this entire resolution is production-ready and primed for deployment.
“Excessive-resolution digital shows play a pivotal function in guaranteeing the protected operation of electrical autos (EVs) with restricted vary. They furnish drivers with indispensable data, together with battery standing updates, navigation steerage, and the whereabouts of close by charging stations,” stated Dan Loop, Vice President and Basic Supervisor, of Automotive Edge Product Traces, NXP. “The NXP resolution delivers superior graphics together with smartphone connectivity to allow a wealthy consumer expertise in a really cost-effective system resolution. The production-ready DCC platform now makes it that a lot simpler for purchasers to get their merchandise to market shortly.”
“Our NXP i.MX RT1170-based cluster with superior efficiency graphics and wealthy wi-fi and audio connectivity delivers a digital driving expertise that takes us into the way forward for two-wheeler mobility. Constructed utilizing Tessolve’s 3-D product engineering precept, which stands for, Growth platform, Deployable system, or Spinoff resolution, our cluster will be adopted by OEMs both “as is” or will be personalized for his or her wants. Tessolve accelerates OEMs’ time to market with distinctive ODM talents, providing digital cluster white labeling as nicely”, stated Kiran Kumar Nagendra, AVP- Embedded Programs, Tessolve.
To study extra about digital related clusters click on right here.
About Tessolve
Tessolve is a number one System productization and Silicon Engineering resolution supplier, working in 10 international locations throughout the US, Europe, and APAC areas with in-house infrastructure and world-class lab services with a world Engineering energy of 3000 Engineers.
Tessolve provides product improvement from idea to manufacturing as an ODM, targeted on Automotive, Industrial IoT, Avionics, and semiconductor market segments accelerating time to market by ready-to-use System on Modules & Utility System Options, by deep area experience, modern concepts, process-oriented method, established ecosystem partnerships, together with provide chain & postproduction life cycle administration.
For extra data, go to https://www.tessolve.com
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